Manufactured by bonding method "SOI wafer"
We can accommodate a small number of pieces, making it ideal for prototype development! We can provide consistent manufacturing according to your needs!
We provide SOI wafers manufactured using a bonding method. We can also offer custom production according to specifications and e-SOI wafers with controlled edge shapes. We accommodate small lot sizes and can support patterning (such as PZT, Deep-RIE, etc.). Please first contact us with your main specifications. For small lots, we may be able to respond quickly using our stock. For new production, we can accommodate orders starting from 15 pieces, depending on the specifications. We can also provide SOI wafers (e-SOI wafers) with controlled edge shapes. For more details, please download the catalog or contact us.
- 企業：大村技研
- 価格：Other
